Intel working with Vertiv on cooling for new AI chip

By Dylan Bushell-Embling
Friday, 01 December, 2023

Intel working with Vertiv on cooling for new AI chip

Critical digital infrastructure provider Vertiv has revealed it is collaborating with Intel to develop a liquid cooling solution to support Intel’s upcoming Gaudi3 AI accelerator chip.

The new chip, scheduled to launch in 2024, will seek to support a revolution in AI capabilities. Because AI applications and other high-performance computing capabilities emit higher amounts of heat, organisations are turning to liquid-cooling solutions.

Thanks to the partnership with Vertiv, the Gaudi3 will enable both liquid-cooled and air-cooled servers supported by Vertiv’s pumped two-phase cooling infrastructure for data centres.

The liquid-cooled solution has been tested up to 160 kW accelerator power using facility water from 17 up to 45°C, while the air-cooled solution has been tested up to 40 kW of heat load, and can be deployed in warm ambient air data centres up to 35°C.

Vertiv SVP for Global Thermal Line of Business John Niemann said the joint solution will help customers implement techniques such as heat reuse, warm water cooling and free-air cooling, while enabling reductions in both power and water usage effectiveness.

“The Intel Gaudi3 AI accelerator provides the perfect solution for a Vertiv and Intel collaboration,” he said. “Vertiv continues to expand our broad liquid cooling portfolio, resulting in our ability to support leaders of next-generation AI technologies, like Intel. Vertiv helps customers accelerate the adoption of AI quickly and reliably, while also helping them to achieve sustainability goals.”

Image: Vertiv liquid cooling system.

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